A study on surface roughness of silicon wafer by using SiC electrophoretic deposition polishing

碩士 === 國立中央大學 === 機械工程學系 === 106 === This research is focus on electrophoretic deposition polishing and mechanical polishing to improve the surface roughness of silicon wafer. The polishing in this article are experimented with the parameters of load, polishing time, polishing wheel rotation speed....

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Bibliographic Details
Main Authors: BANG-JI LIU, 劉邦霽
Other Authors: 傅尹坤
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/9q4ncd