Aging Prediction Method for Laser Source and Lens of Laser Cutting Machine
碩士 === 國立高雄第一科技大學 === 電機工程研究所碩士在職專班 === 106 === A laser cutting machine is pupularly used to slot wafer in the semiconductor packaging industry. The profile of a well cutted die should be evenness; however, it could appear crack or reamining metal when cutting quality getting worse such as insuffici...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/huvnze |