Warpage Analysis for Package-on-Package Structure Based on Substrate Design
碩士 === 國立高雄第一科技大學 === 機械與自動化工程系碩士專班 === 106 === In recent years, rapid development of electronic product gradually towards to compact size and high performance. With increasing demands, Package-on-Package (POP) technology is recently developed for manufacturing compact products. However, the POP tec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/c6ry27 |