Effects of chip thickness, solder ball shape and underfill dispensing location on plastic strain energy density of corner dot underfilling pattern of chip scale package module.
碩士 === 國立屏東科技大學 === 材料工程研究所 === 106 === In this paper, a 3-D model of a commercial CSP module were established by Solidworks and Ansys softwares to analysis the plastic strain energy density in the solder balls. Effects of the shape of solder ball, die thickness and underfill dispensed at the corne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/jg482v |