Effects of chip thickness, solder ball shape and underfill dispensing location on plastic strain energy density of I-shaped underfilling pattern of chip scale package module.
碩士 === 國立屏東科技大學 === 材料工程研究所 === 106 === This study reports a commercial product of CSP module without underfill dispensed leading to the electricity failure after temperature cycling test. The CSP failure is due to the rupture of outermost solder ball at the upper right right corner of die. This stu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64z2hm |