Heat Transfer Reliability Improvement of High-Power 2.5D IC Package on System Level
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 106 === This study is based on the numerical simulation to evaluate the thermal behaviors for different package types, such as graphics card, central processing unit, northbridge chip and southbridge chip. And it could be explored the thermal performance impacts an...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/469w6s |