Surface Treatment on Polyimide by an Atmospheric Pressure Plasma Jet for Electroless Copper Plating
碩士 === 國立臺灣大學 === 化學工程學研究所 === 106 === Polyimide (PI) is of great interest due to its flexibility, high thermal stability, low cost and high conductivity of copper. However, PI with low surface energy causing the better adhesion to be more critical in copper coating processes. The atmospheric press...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2w7e69 |