Analysis on Pad Performance for Chemical Mechanical Polishing/Planarization of Shallow Trench Isolation
碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === Chemical mechanical planarization/polishing (CMP) has been widely adopted in the integrated circuit (IC) fabrication. Due to demand of IC downsizing to nanoscale, CMP process stability and reproducibility continue to face stringent challenges. Polishing pad surf...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6x27u4 |