Study on Diamond Wire Sawing Process Using Minimum Quantity Lubrication with Graphite Nanofluids
碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === The slicing process is one of the front-end processes of the current semiconductor industry. The main processing method is fixed-abrasive diamond wire sawing. During the processing, a large amount of cutting fluid is required to reduce the temperature in the cut...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/s4f3b9 |