Microcellular Injection Molding Process of Polishing Pad and Application in Chemical Mechanical Planarization Process

• Main Authors: Yi-Shiuan Li, 李怡萱
• Other Authors: Chao-Chang Chen
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/6xnatj

碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === This study aims to develop a microcellular injection molding (MIM) process of molded pads for chemical mechanical planarization (CMP). Due to its advantages of short process time and adjustable microstructure, this study applies MIM for manufacturing CMP consumables, polishing pads. This study is divided into three parts: the first is the influence of processing parameters and different materials on the structure of the finished microcellular injection molded product is discussed. The material type and supercritical fluid (SCF) dosage have been set as control variables. Moldex3D has been used to simulate two types of TPU and four different SCF dosage. Then, two types of TPU material and two SCF dosage levels have been used to manufacture four types of polishing pad samples with pore sizes 62.9, 72.8, 86.4, and 99.1 μm, respectively. In the second part, polishing pad samples have performed structural observation and mechanical properties measurement, including compressibility, compression recovery rate, hardness, Young's modulus, Poisson’s ratio and bearing area ratio. Experimental results can be drawn into a static property radar chart, which clearly indicates the properties of each polishing pad, and thereby identify the suitable process for the polishing pad and the applicable processing parameters. Finally, the MIM polishing pads have been applied to glass polishing, where a commercial IC1000 polishing pad is used as a reference. The MRR of IC1000 pad is 210.89 nm/min, and 135.88, 127.38, 106.15, 93.4 nm/min for the developed MIM pads. Results of correlation analysis show that hardness, Young's modulus, Poisson’s ratio and bearing area ratio (Spk) are highly correlated with MRR. Concept of dispersion and distribution that are usually used in composite materials have been applied to describe the pore structure distribution in polishing.