The Study of the Relationship between Factors of Glass Wafer Dicing and the Quality of Top Side Chipping
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === Glass substrates have many challenges in wafer dicing process due to its hard and brittle amorphous materials characteristics, and top side chipping is a key factor in glass dicing process. This thesis is focus on the factor of top side chipping...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5pn967 |