The Influence of Ground Plane Design Adjacent to Ball Pad on Signal Integrity
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === With the rapid development of semiconductor manufacturing technology, the required frequencies of electronic devices has been developed for higher frequencies and higher transmission rates. With the switching time getting shorter, the speed of IC...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fee7k7 |