The Study of Automated Material Handling System Phase in Bumping 300mm Processing
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === This study is aimed at introducing the technical application of automatic dispatching, dispatching logic and from to optimal handling path calculation for the 300 mm wafer level package bump process automation handling system. Through the machine a...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/uv2rqe |