| Summary: | 碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === This study is aimed at introducing the technical application of automatic dispatching, dispatching logic and from to optimal handling path calculation for the 300 mm wafer level package bump process automation handling system. Through the machine automation program, the machine status is immediately collected, and the reward is given to the real-time dispatching system. When the dispatching system receives the correct instruction, it dispatches the work industry. Then the material control system receives the dispatching instruction and immediately issues the command to dispatch the vehicle. The car process is carried out by the dispatching logic to calculate the optimal transport path, so that the transport path is carried at the shortest distance. The Overhead Shuttle (OHS) is used for unloading and unloading to ensure the safety of moving materials and vehicles, and to transport the 300mm boat box from the designated machine through the automatic handling mode. The load port is sent to the specified stocker or sent from the specified stocker to the specified machine load port mode, which makes the factory handling operation more efficient and uses the calculation of “from to” to make the path of the dice to be optimal and the shortest, and thus reduce the 300mm boat box transfer time.
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