Research on semiconductor wire bonding process of heat block tooling

• Main Authors: HUNG,CHIN-LIN, 洪沁琳
• Other Authors: SHIH,MING-CHANG
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/656gzb

碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === Research on semiconductor of QFN and QFP product structure in IC assembly. Heat block is wire bonding process assisted tooling in IC assembly. Purpose is prevention of ball lifting, finger bonding fail, loop height issue, ball forming issue, etc. We would like to keep wire bonding process stability. In our research we found heat block and leadframe have design rule and satisfying criteria in IC assembly package layout.We also be application to reliability test that confirmed Package design quality. This research use FMEA to be main structure of this study. FMEA(Failure Mode and Effects Analysis)would build up analysis model of wire bonding process versus heat block design.