Low Temperature Zinc-Aluminophosphate Glass Light Conversion Layer for White Light Emitting Diode Devices.
碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 106 === Nowadays LED lighting device and its package are requested for high performance, strengthened thermal and mechanical stability, and improved reliability for advanced applications. Conventional LED lighting package is based on epoxy and silicone for pho...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pa79nz |