Reliability Assessment and Sensitivity Analysis for Printed Circuit Board Assembly
碩士 === 國立臺北科技大學 === 工業工程與管理系 === 106 === The development of electronic packaging technology is facing the demand of light, thin, short and small. At the joint of materials, the breaking stress is often caused by the thermal expansion between materials. Therefore, when the electronic components compl...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/xsd255 |