MEMS and IPD/CMOS RF Front-Ends
碩士 === 國立臺北科技大學 === 電子工程系 === 106 === This thesis is divided into two sections, the first section using 0.18 µm CMOS process which is provided by Taiwan Semiconductor Manufacturing Company (TSMC) and glass-integrated passive device (GIPD) process which is provided by Walsin Technology Company to imp...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | en_US |
Published: |
2018
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Online Access: | http://ndltd.ncl.edu.tw/handle/ezzhrp |