MEMS and IPD/CMOS RF Front-Ends

碩士 === 國立臺北科技大學 === 電子工程系 === 106 === This thesis is divided into two sections, the first section using 0.18 µm CMOS process which is provided by Taiwan Semiconductor Manufacturing Company (TSMC) and glass-integrated passive device (GIPD) process which is provided by Walsin Technology Company to imp...

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Bibliographic Details
Main Authors: MENG-HSIANG HUNG, 洪盟翔
Other Authors: Sen Wang
Format: Others
Language:en_US
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/ezzhrp