The effects of supercritical CO2 emulsion and surfactants on the electroless nickel plating and the blind hole metallization of PCB
碩士 === 國立臺北科技大學 === 製造科技研究所 === 106 === With the high density and high precision requirement of electronic products, printed circuit boards (PCB) are also facing the evolution into multilayer boards. Electroless nickel immersion gold (ENIG) is a process that is widely used in the surface treatment o...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ccgvb8 |