A Non-Destructive RF Signature Measurement Technique for IC Package Electrical Failure Analysis
碩士 === 國立雲林科技大學 === 電子工程系 === 106 === Because of the thin, compact and low power requirements of computers, communications, and consumer products, the IC process technology has become more and more advanced, which in turn has led to continuous innovation in IC package technology and designed toward...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/dhm6pq |