| Summary: | 碩士 === 國立雲林科技大學 === 電子工程系 === 106 === Because of the thin, compact and low power requirements of computers, communications, and consumer products, the IC process technology has become more and more advanced, which in turn has led to continuous innovation in IC package technology and designed toward miniaturized packages. Because of the miniaturization of the IC package, the wire pitch inside the package body has also been reduced, making the IC package's failure analysis very challenging. How to rapidly perform package electrical inspection and failure analysis has become an essential issue for the IC package factory.
X-ray imaging or Ultrasound imaging is a common non-destructive detection method. These methods do not require dismantling the package, but it is difficult to judge the image captured by a small, high-density, multi-layered package, making it difficult to determine the point of failure. Another non-destructive analytical technique is the use of package pin electrical analysis techniques, which can immediately determine the type of fault from the measured electrical signal. It is often used: parameter analyzer, Automatic curve tracking. Both of these traditional measurement techniques detect the fault point by inputting a DC or low-frequency resistance or impedance. While traditional techniques provide an essential reference for fault analysis, they cannot read more information on faults other than short circuits and open circuits when dealing with high-density advanced chips and their packages. Failure analysis at this time will fall into the dilemma of using destruction analysis or not.
Different from the mentioned failure analysis methods, this thesis proposes the impedance response characteristic analysis and detection technologies for some specific frequencies, which applied to the detection of electrical characteristics of ICs and failure analysis of non-destructive defective products. Each pin of the IC has a unique frequency impedance response characteristic and compares the impedance characteristics of the good IC package to determine possible defects in the failure package. This technology can accurately and effectively detect the unique electrical characteristics and fault analysis on the IC package. This technology measures the window ball grid array IC package provided by the IC packaging company. The measurement frequency set to 100 kHz to 200 MHz, and several normal and abnormal IC packages are compared. From the actual measurement of IC samples, 100% of the IC's possible assembly problems can be identified.
Keywords：IC package, non-destructive testing, network analyzer, smith chart
|
|---|
