Preparation of Chemical Mechanical Polishing Slurry for Through Silicon Via
碩士 === 元智大學 === 化學工程與材料科學學系 === 106 === In the Through-Silicon Via required chemical polishing slurry, this work uses potassium hydroxide, abrasive particles and ethylenediamine concentrations adjusting to planarizating and quality. This study focuses on the use of potassium hydroxide and ethylenedi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/xdcydw |