High-speed Cu Electrodeposition and Its Packaging Applications
碩士 === 元智大學 === 化學工程與材料科學學系 === 106 === Issues of high pin count fine pitch have been a trend in high-density interconnects (HDIs) in packaging. Copper (Cu) pillar bumps (CPBs) can be a solution of shorting the adjacent solder balls. The effects of the plating current density (j) on the electroplate...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k32ku2 |