Behavior of Tin Electromigration and Tin Whisker Growth Mechanism Induced by Electric Current
博士 === 元智大學 === 化學工程與材料科學學系 === 106 === Electromigration has become a critical issue for reliability in Sn-based conducting materials that are used in advanced microelectronic packages with micro-joint integration. In this study, Blech structure was used to characterize the Sn electromigration behav...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/859fw5 |