Ground Via Design for Suppressing Ground Bounce Noise Caused by Plated Through-Hole Signal Via in Multilayer PCBs
碩士 === 中原大學 === 電子工程研究所 === 107 === With the advancement of the high-speed digital era, the operating frequency of electronic product circuits is getting more and more high frequency and the transmission speed of the signal is also getting faster. The process of high-speed digital signal transmissio...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/964vvc |