Analysis of Time Domain Waveform for Through-Hole Via in Thick Layer Printed Circuit Board
碩士 === 中原大學 === 通訊工程碩士學位學程 === 107 === This paper studies the effects of thick layer printed circuit board of the signal via on the time-domain reflection waveforms、S11、S21 and impedance in high speed digital circuits. Use the thick layer printed circuit board in reality do a lot of parametric analy...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/fx6h47 |