Semiconductor Back-End Packaging Equipment Manufacturer Competition Strategy - G Companys as an Example

碩士 === 逢甲大學 === 經營管理碩士在職學位學程 === 107 === Wafer processing equipment will rise 11.7% in 2018 to $50.8 billion. Fab facilities equipment, wafer manufacturing, and mask/reticle equipment, are expected to grow 12.3% to $2.8 billion this year. The assembly and packaging equipment segment is projected to...

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Bibliographic Details
Main Authors: LI, HUI-CHUAN, 李惠娟
Other Authors: YANG, KUEN-FENG
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/b6gs37