Semiconductor Back-End Packaging Equipment Manufacturer Competition Strategy - G Companys as an Example

• Main Authors: LI, HUI-CHUAN, 李惠娟
• Other Authors: YANG, KUEN-FENG
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/b6gs37

碩士 === 逢甲大學 === 經營管理碩士在職學位學程 === 107 === Wafer processing equipment will rise 11.7% in 2018 to $50.8 billion. Fab facilities equipment, wafer manufacturing, and mask/reticle equipment, are expected to grow 12.3% to $2.8 billion this year. The assembly and packaging equipment segment is projected to grow 8% to $4.2 billion in 2018, while semiconductor test equipment is forecast to increase 3.5% to $4.9 billion this year. South Korea will remain the largest equipment market for the second year in a row. China will be second biggest and Taiwan will be third. In 2019, equipment sales in China will surge 46.6%. China, South Korea, and Taiwan are forecast to remain the top three markets, with China rising to the top. The growth of Taiwans spending in fab equipment for the semiconductor sector is expected to cool down in 2019, due to lack of new investment in the memory production. However, it is expected to show a high growth in 2020, as a result of the continuous investment of wafer foundries in advanced processes and production capacity, and the improved performance of memory manufacturers. In the medium and long-term period of Taiwan, the overall spending is still showing a steady growth. In recent years, semiconductor packaging and testing equipment manufacturers are facing high competitive challenges, due to the users’ high demanding in the quality, cost, delivery and service of the equipments. The development of semiconductor process equipments is closely related to the semiconductor process technologies; in terms of business operation and management will be the competitiveness indicator. The competitive advantage can be conducted by effectively reducing the manufacturing time. The semiconductor packaging and testing equipment industry faces high-end devices and high investment characteristics. With the rapid development of products and processes, the price of new packaging and testing equipment are all increased; the capital expenditure of the semiconductor packaging and testing equipment industry must be continuously revised upwards. Equipment manufacturers, upstream and downstream suppliers should establish a complete supply chain structure and internal resources through their own familiarity with products and markets, and integrate the technology advantages and innovation, mergers and strategic alliances to define the competitive strategy of "service opportunities" for customers.