Effects of materials characteristics on ultrasonic bonding for Cu/Cu microelectronic joints
碩士 === 國立中興大學 === 材料科學與工程學系所 === 107 === Due to the advantages of low electrical resistance and size miniaturization, Cu to Cu direct bonding has become one of the important trends in microelectric interconnect fabrication. However, strict processing requirements, e.g. high vacuum, long bonding tim...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi/login?o=dnclcdr&s=id=%22107NCHU5159057%22.&searchmode=basic |