Automated optical inspection the development for the negative photoresist

碩士 === 國立中興大學 === 物理學系所 === 107 === This thesis mainly discusses the measurement problems encountered in the process of detecting the polymer polymer protective layer in the wafer bump packaging process. At present, in the wafer bump protective layer lithography process, the time change of the surfa...

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Bibliographic Details
Main Authors: Shang-Wei Chen, 陳上偉
Other Authors: Chien-Chung Jeng
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/cgi-bin/gs32/gsweb.cgi/login?o=dnclcdr&s=id=%22107NCHU5198004%22.&searchmode=basic