Using the Taguchi method and the Response Surface Methodology to study the optimal combination of parameters for IC packaging and soldering process
碩士 === 國立勤益科技大學 === 工業工程與管理系 === 107 === The semiconductor industry has been highly competitive in recent years，However the technology continues to improve and more new products are developed，Consumers are paying more and more attention to the demand and quality of，electronic products，With the boomi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98dz93 |