The Material Interaction Behaviors in a Cu/Sn/Cu Interconnect Induced by Room Temperature Electromigration
博士 === 國立成功大學 === 材料科學及工程學系 === 107 === The aim of the present study is to clarify the fundamental athermal effects of electromigration on the material interaction behaviors in a Cu/Sn/Cu interconnect. The electromigration experiment was conducted under a room temperature ambient condition, approxim...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ybtvp2 |