The Microstructure and Shear Properties of Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Joints
碩士 === 國立成功大學 === 材料科學及工程學系 === 107 === This study investigated the effect of Cu (0.1, 0.2, 0.4 wt%) and Ti (0.01, 0.02, 0.04 wt%) additions on the shear properties, interfacial reaction and microstructure of high temperature Ni/Zn-25Sn-xCu-yTi/Ni solder joints. Ni/Zn-25Sn/Ni consisted of interfacia...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2019
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Online Access: | http://ndltd.ncl.edu.tw/handle/nvm233 |