The Microstructure and Shear Properties of Zn-25Sn-xCu-yTi High Temperature Pb-free Solder Joints

碩士 === 國立成功大學 === 材料科學及工程學系 === 107 === This study investigated the effect of Cu (0.1, 0.2, 0.4 wt%) and Ti (0.01, 0.02, 0.04 wt%) additions on the shear properties, interfacial reaction and microstructure of high temperature Ni/Zn-25Sn-xCu-yTi/Ni solder joints. Ni/Zn-25Sn/Ni consisted of interfacia...

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Bibliographic Details
Main Authors: Min-RenChen, 陳民仁
Other Authors: Kwang-Lung Lin
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/nvm233