Aging Behavior of Epoxy Molding Compound and its Application in Reconstituted Wafer Warpage Control

碩士 === 國立成功大學 === 機械工程學系 === 107

Bibliographic Details
Main Authors: Ting-WenChen, 陳渟文
Other Authors: Tz-Cheng Chiu
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/56r9f7