Using Design of Experiments to Determine the Optimal Process Parameter-Setting for Reducing the Solder Resist Roughness-A Case Study of a Substrate Company in Taiwan

碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 107 === Assembling process is a combination of carrier and wafer. Carrier transmits the signal from wafer to other components after assembling, wherein carriers act as a signal transmission. Therefore, the combination of the carrier and the wafer is one of the key...

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Bibliographic Details
Main Author: 鄭仕濬
Other Authors: Tong, Lee-Ing
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/z2np7u