Using Design of Experiments to Determine the Optimal Process Parameter-Setting for Reducing the Solder Resist Roughness-A Case Study of a Substrate Company in Taiwan
碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 107 === Assembling process is a combination of carrier and wafer. Carrier transmits the signal from wafer to other components after assembling, wherein carriers act as a signal transmission. Therefore, the combination of the carrier and the wafer is one of the key...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/z2np7u |