Direct Bonded Aluminum/Alumina using Various Elements as Interlayer for High Power Device Substrate
碩士 === 國立交通大學 === 材料科學與工程學系所 === 107 === Direct bonded copper (DBC) substrates have been widely used in power electronics and insulated gate bipolar transistors (IGBT) modules. However, poor thermal cycling reliability of DBC substrates restrict its applications. Direct bonded aluminum (DBA) substra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/3r255g |