On Power Supply Pads Planning for Wire-bonded IC
碩士 === 國立交通大學 === 電子研究所 === 107 === In wire-bonding technology, Input/Output (I/O) pads are located along the peripheral of integrated circuit (IC) and power pad placement is limited by available I/O pad candidates. Power pads supply voltage to the IC through power delivery network (PDN), hence insu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r5pww4 |