Application and Material Properties of Low Thermal Budget Polyimide in Asymmetric Cu/Sn Hybrid Bonding in 3D Integration Platform
博士 === 國立交通大學 === 電子研究所 === 107 === Hybrid bonding technology is one of the key technologies of 3D integrated circuits (3D IC). It has high material selectivity and high semiconductor process compatibility, enabling heterogeneous integration and achieving of lower power, smaller size and more functi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/g8d3y2 |