Fast Chip Temperature Estimation and Power Dissipation Extraction in a Smartphone
碩士 === 國立交通大學 === 電信工程研究所 === 107 === High temperatures caused by dramatically increasing integration density and power consumption of VLSI circuits have several significant impacts on VLSI systems and handheld devices. To avoid overheating of a smartphone, dynamic thermal management (DTM) and dynam...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/wphx45 |