Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
碩士 === 國立交通大學 === 電信工程研究所 === 107 === Heat pipe is a passive cooling solution for electronic systems and has excellent heat transfer ability to pull heat away from hot regions to cold regions. However, its heat transfer ability will be decreased by not only the number of bends but also bending degre...
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| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9qw7z6 |