Global Yield-Driven Redundant Power Bump Assignment for Power Network Robustness
碩士 === 國立交通大學 === 電信工程研究所 === 107 === During the package manufacturing process, open defect of power bumps may cause insufficient power supply and degrade the power network yield. This work presents a redundant power bump insertion method to ensure power integrity by considering the power bump yield...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/75d42u |