Dynamic Compact Thermal Modeling and Transient Analysis on Smartphone by Resistor-Capacitor Ladder Network
碩士 === 國立交通大學 === 電信工程研究所 === 107 === High temperatures caused by dramatically increasing integration density and power consumption of VLSI circuits have several significant impacts on chips and handheld devices. To avoid overheating, an effective temperature estimation mechanism is important. In th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/d42w2a |