Design of a 5.2-GHz Low-Noise Amplifier (LNA) Using Integrated Fan-Out (InFO) Wafer-Level Packaging Technology for Wi-Fi System
碩士 === 國立交通大學 === 電信工程研究所 === 107 === In this thesis, we proposed a 5.2-GHz low-noise amplifier (LNA) implemented in Integrated Fan-Out (InFO) wafer-level packaging (WLP) technology. We fabricated gate inductor on the redistribution layer (RDL), and then connected with a low noise amplifier (LNA) ch...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/j5kx5j |