Three-dimensional micro features of copper-tin alloy with Cu6Sn5 in Nanocrystals prepared by electroplating and their characterization
碩士 === 國立中央大學 === 材料科學與工程研究所 === 107 === In this study, three-dimensional microstructures of copper-tin alloys and its intermetallic compounds were prepared by instant image guided micro-plating. The electroplating system uses a platinum wire with a wire diameter of 125 μm as an anode, and a copper...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4774y8 |