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碩士 === 國立中央大學 === 電機工程學系 === 107 === Gallium nitride (GaN) materials are attractive to be used in high power amplifier and RF power applications for 5G communication technology due to their high breakdown electric field, high electron mobility and high electron saturation speed. However, GaN power d...

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Main Authors: YI-NAN ZHONG, 鍾易男
Other Authors: Yue-Ming Hsin
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/py5j5q
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spelling ndltd-TW-107NCU054421022019-10-22T05:28:16Z http://ndltd.ncl.edu.tw/handle/py5j5q none 高頻氮化鋁鎵/氮化鎵高速電子遷移率電晶體佈局設計及特性分析 YI-NAN ZHONG 鍾易男 碩士 國立中央大學 電機工程學系 107 Gallium nitride (GaN) materials are attractive to be used in high power amplifier and RF power applications for 5G communication technology due to their high breakdown electric field, high electron mobility and high electron saturation speed. However, GaN power devices operating at high currents and high voltages will cause high channel temperature and cause reliability issues. The self-heating effect causes the drain current to drop and limits the output power, which also affects the lifetime of the devices. One of the effective ways to reduce thermal effects is the backside via process and layout. In this paper, two AlGaN/GaN high electron mobility transistors (HEMTs) with different backside vias are used to study thermal and high frequency characteristics. Connecting the source through the backside via to the backside of the wafer can effectively dissipate heat. A transistor with a backside via outside the active region is called an OSV (outside backside via) layout transistor; in addition to having a backside via outside the active region, there is an additional backside via in the middle source of active region. The device is called an ISV (internal backside via) layout transistor. The DC characteristics of the two transistors are presented at different temperatures, including thermal resistance analysis, and a small signal model was established to study the dependence of the intrinsic parameters of the two transistors on temperatures. In addition, the 5G communication technology has a very high linearity requirement. This paper discusses the variation and influence of the linearity of different gate-to-source length (LGS) transistors. In general, the resistance is a linear component, and the larger the resistance, the greater the linearity of the transistor. In order to improve the linearity of GaN devices, AlGaN/GaN HMETs with different gate-to-source distance (LGS) layouts are designed to study DC characteristics, high frequency characteristics, large signal characteristics and linearity. Yue-Ming Hsin 辛裕明 2019 學位論文 ; thesis 90 zh-TW
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language zh-TW
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sources NDLTD
description 碩士 === 國立中央大學 === 電機工程學系 === 107 === Gallium nitride (GaN) materials are attractive to be used in high power amplifier and RF power applications for 5G communication technology due to their high breakdown electric field, high electron mobility and high electron saturation speed. However, GaN power devices operating at high currents and high voltages will cause high channel temperature and cause reliability issues. The self-heating effect causes the drain current to drop and limits the output power, which also affects the lifetime of the devices. One of the effective ways to reduce thermal effects is the backside via process and layout. In this paper, two AlGaN/GaN high electron mobility transistors (HEMTs) with different backside vias are used to study thermal and high frequency characteristics. Connecting the source through the backside via to the backside of the wafer can effectively dissipate heat. A transistor with a backside via outside the active region is called an OSV (outside backside via) layout transistor; in addition to having a backside via outside the active region, there is an additional backside via in the middle source of active region. The device is called an ISV (internal backside via) layout transistor. The DC characteristics of the two transistors are presented at different temperatures, including thermal resistance analysis, and a small signal model was established to study the dependence of the intrinsic parameters of the two transistors on temperatures. In addition, the 5G communication technology has a very high linearity requirement. This paper discusses the variation and influence of the linearity of different gate-to-source length (LGS) transistors. In general, the resistance is a linear component, and the larger the resistance, the greater the linearity of the transistor. In order to improve the linearity of GaN devices, AlGaN/GaN HMETs with different gate-to-source distance (LGS) layouts are designed to study DC characteristics, high frequency characteristics, large signal characteristics and linearity.
author2 Yue-Ming Hsin
author_facet Yue-Ming Hsin
YI-NAN ZHONG
鍾易男
author YI-NAN ZHONG
鍾易男
spellingShingle YI-NAN ZHONG
鍾易男
none
author_sort YI-NAN ZHONG
title none
title_short none
title_full none
title_fullStr none
title_full_unstemmed none
title_sort none
publishDate 2019
url http://ndltd.ncl.edu.tw/handle/py5j5q
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