0.8 mil Au-Pd coated copper wire parameter optimization in BGA packaging wire bonding process.
碩士 === 國立彰化師範大學 === 機電工程學系 === 107 === The semiconductor packaging and testing industry is developing principles with improved transmission efficiency, better heat dissipation, increased I/O count, volume miniaturization and lower cost with quality reliability. The improvement of process yield in th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gy4juw |