0.8 mil Au-Pd coated copper wire parameter optimization in BGA packaging wire bonding process.

• Main Authors: Chou,Yung-Jen, 周勇任
• Other Authors: Wu,Menq-Jiun
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/gy4juw

碩士 === 國立彰化師範大學 === 機電工程學系 === 107 === The semiconductor packaging and testing industry is developing principles with improved transmission efficiency, better heat dissipation, increased I/O count, volume miniaturization and lower cost with quality reliability. The improvement of process yield in the characteristics of product development principles is the continuous goal of each test and test factory. Wire Bonding is a bottleneck process in a ball grid array package (BGA). The parts that directly affect the quality of the work in wire bonding are raw materials (wafer, substrate, metal wire), parts (capillary), and wire bonding parameters. The JMP software's Taguchi experimental design method was used to analyze and obtain the optimal wire bonding parameters. The material was measured by the inter metallic compound, the tool microscope measuring sphere, the wire pull test, the ball shear test and the crater test. In this study, the total alarm rate of the optimum parameters was reduced from 0.57% to 0.11% compared with the control parameters, and the hourly output increased by 58.74 pcs from 54.50 pcs, and the product yield increased from 99.77% to 99.85%.