Influence of Flow Rates of Copper-plating Tank on Via-Filling Plating Property
碩士 === 國立高雄師範大學 === 化學系 === 107 === The demand for filling plating were increased with the rapid progress of technology in recent years, however, voids appearing in the filling plating result in the confidence risk related to products. It is the important topic of the current research. The main pu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7n8jgf |