Developing the prediction models of solder paste volume for stencil printing process in surface mount assembly-A case study of stencil printing for TQFP package
碩士 === 國立高雄科技大學 === 工業工程與管理系 === 108 === Surface mount technology (SMT) is the main process to produce many types of modern electronics products in electronics assembly industry. SMT consists of three sub-processes: (1) solder paste stencil printing, (2) component placement, and (3) solder reflow. B...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r974z2 |